Indicative Content |
1. Circuit Simulation & Layout
SPICE Device Elements; Semiconductor Devices; Analysis Modes and Techniques; Full-Custom IC Layout.
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2. Semiconductor Fabrication
Wafer Preparation and Mask-making; Layering, Patterning and Doping; Electrical Tests and Die Packaging.
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3. Semiconductor Device Modelling
Semiconductor Materials and their Properties; PN Junction and BJT Modelling; MOSFET Modelling; Amplifier Configurations.
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4. Amplifier & Cascode Configurations
BJT & MOS integrated amplifiers; Cascoded transconductors and loads.
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5. Current Mirrors & References
MOS and bipolar Current Mirroring; Temperature and Sensitivity Analysis; Voltage and Current Referencing.
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6. Differential Amplifiers
Qualitative Analysis and Bipolar/MOSFET Differences; Small-Signal and Large-Signal Analysis; Cascode Differential Amplifiers; Common-Mode Rejection; Use of Active Loads.
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Module Resources
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Recommended Book Resources |
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B. Razavi. (2013), Fundamentals of Microelectronics, 2nd ed.. Wiley, [ISBN: 978-111815632].
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Supplementary Book Resources |
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R. Jacob Baker. (2019), CMOS: Circuit Design, Layout, and Simulation, 4th. Wiley-IEEE Press, p.1280, [ISBN: 978-111948151].
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Behzad Razavi. (2017), Design Of Analog CMOS Integrated Circuits, 2nd. McGraw-Hill, [ISBN: 978-932598327].
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R. Yanda, M. Heynes & A. Miller. (2005), Demystifying Chipmaking, Elsevier, p.280, [ISBN: 978-075067760].
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This module does not have any article/paper resources |
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This module does not have any other resources |
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